ISSN 2380-4505
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
A New Embedded Package Structure and Technology for the Next Generation of WLP, the Wafer level Fun-Out Package - WFOP (TM)
A New Embedded Package Structure and Technology for the Next Generation of WLP, the Wafer level Fun-Out Package - WFOP (TM)
Akio Katsumata,
Katsumata, Akio. 2013. “A New Embedded Package Structure and Technology for the Next Generation of WLP, the Wafer Level Fun-Out Package - WFOP (TM).” IMAPSource Proceedings 2013 (DPC): 1520–58. https://doi.org/10.4071/2013DPC-wp24.