Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging
Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging
Scott Hayes, Tony Gong, Doug Mitchell, Michael Vincent, Jason Wright, Yap Weng Foong,
Hayes, Scott, Tony Gong, Doug Mitchell, Michael Vincent, Jason Wright, and Yap Weng Foong. 2013. “Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging.” IMAPSource Proceedings 2013 (DPC): 1458–85. https://doi.org/10.4071/2013DPC-wp22.