Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging
Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging
Hayes, Scott, Tony Gong, Doug Mitchell, Michael Vincent, Jason Wright, and Yap Weng Foong. 2013. “Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging.” IMAPSource Proceedings 2013 (DPC): 1458–85. https://doi.org/10.4071/2013DPC-wp22.
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