Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Semeiconductor Packaging Trends and Materials Challenges
Semeiconductor Packaging Trends and Materials Challenges
Mahadevan “Devan” Iyer,
Iyer, Mahadevan “Devan.” 2013. “Semeiconductor Packaging Trends and Materials Challenges.” IMAPSource Proceedings 2013 (DPC): 310–33. https://doi.org/10.4071/2013DPC-keynote2-TexasInstruments.