Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Electrical Characterization on a High-Speed Wafer-Level Package
Electrical Characterization on a High-Speed Wafer-Level Package
Kai Liu, YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Susan Park, Billy Ahn,
Liu, Kai, YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Susan Park, and Billy Ahn. 2013. “Electrical Characterization on a High-Speed Wafer-Level Package.” IMAPSource Proceedings 2013 (DPC): 1937–62. https://doi.org/10.4071/2013DPC-tha23.