Electrical Characterization on a High-Speed Wafer-Level Package

Kai Liu; YongTaek Lee; HyunTai Kim; MaPhooPwint Hlaing; Susan Park; Billy Ahn

doi:10.4071/2013DPC-tha23

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Liu, Kai, YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Susan Park, and Billy Ahn. 2013. “Electrical Characterization on a High-Speed Wafer-Level Package.” IMAPSource Proceedings 2013 (DPC): 1937–62. https://doi.org/10.4071/2013DPC-tha23.

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