Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
An Innovative 2.5D IC Interconnection Reliability System
An Innovative 2.5D IC Interconnection Reliability System
Andrew Levy, Hans Manhaeve, Ed McBain,
Levy, Andrew, Hans Manhaeve, and Ed McBain. 2013. “An Innovative 2.5D IC Interconnection Reliability System.” IMAPSource Proceedings 2013 (DPC): 2056–89. https://doi.org/10.4071/2013DPC-tha34.