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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Ultra-fine pitch Package on Package solution for high bandwidth mobile applications

Rajesh Katkar, Zhijun Zhao, Ron Zhang, Rey Co, Laura Mirkarimi,
Package on Packagereliabilityalternative solutions
https://doi.org/10.4071/2013DPC-tha14
IMAPSource Conference Papers
Katkar, Rajesh, Zhijun Zhao, Ron Zhang, Rey Co, and Laura Mirkarimi. 2013. “Ultra-Fine Pitch Package on Package Solution for High Bandwidth Mobile Applications.” IMAPSource Proceedings 2013 (DPC): 1870–93. https:/​/​doi.org/​10.4071/​2013DPC-tha14.
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