Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Ultra-fine pitch Package on Package solution for high bandwidth mobile applications
Ultra-fine pitch Package on Package solution for high bandwidth mobile applications
Rajesh Katkar, Zhijun Zhao, Ron Zhang, Rey Co, Laura Mirkarimi,
Katkar, Rajesh, Zhijun Zhao, Ron Zhang, Rey Co, and Laura Mirkarimi. 2013. “Ultra-Fine Pitch Package on Package Solution for High Bandwidth Mobile Applications.” IMAPSource Proceedings 2013 (DPC): 1870–93. https://doi.org/10.4071/2013DPC-tha14.