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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Ultra-fine pitch Package on Package solution for high bandwidth mobile applications
Rajesh Katkar
,
Zhijun Zhao
,
Ron Zhang
,
Rey Co
,
Laura Mirkarimi
,
Package on Package
reliability
alternative solutions
•
https://doi.org/10.4071/2013DPC-tha14
IMAPSource Conference Papers
Katkar, Rajesh, Zhijun Zhao, Ron Zhang, Rey Co, and Laura Mirkarimi. 2013. “Ultra-Fine Pitch Package on Package Solution for High Bandwidth Mobile Applications.”
IMAPSource Proceedings
2013 (DPC): 1870–93.
https://doi.org/10.4071/2013DPC-tha14
.
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