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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Thermal modeling approach for enhancing TCNCP process for manufacturing fine pitch copper pillar flip chip packages

Siddharth Bhopte, Jesse Galloway, Kyung-Rok Park, Hyun-Jin Park, Jeong-Han Choi, Ho-Beob Yu, Sung-Hwan Yang,
TCNCP Copper pillars 3D packaging
• https://doi.org/10.4071/2013DPC-ta22
IMAPSource Conference Papers
Bhopte, Siddharth, Jesse Galloway, Kyung-Rok Park, Hyun-Jin Park, Jeong-Han Choi, Ho-Beob Yu, and Sung-Hwan Yang. 2013. “Thermal Modeling Approach for Enhancing TCNCP Process for Manufacturing Fine Pitch Copper Pillar Flip Chip Packages.” IMAPSource Proceedings 2013 (DPC): 441–54. https://doi.org/10.4071/2013DPC-ta22.
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