Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Thermal modeling approach for enhancing TCNCP process for manufacturing fine pitch copper pillar flip chip packages
Thermal modeling approach for enhancing TCNCP process for manufacturing fine pitch copper pillar flip chip packages
Siddharth Bhopte, Jesse Galloway, Kyung-Rok Park, Hyun-Jin Park, Jeong-Han Choi, Ho-Beob Yu, Sung-Hwan Yang,
Bhopte, Siddharth, Jesse Galloway, Kyung-Rok Park, Hyun-Jin Park, Jeong-Han Choi, Ho-Beob Yu, and Sung-Hwan Yang. 2013. “Thermal Modeling Approach for Enhancing TCNCP Process for Manufacturing Fine Pitch Copper Pillar Flip Chip Packages.” IMAPSource Proceedings 2013 (DPC): 441–54. https://doi.org/10.4071/2013DPC-ta22.
Powered by Scholastica, the modern academic journal management system