Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration

Thierry MOURIER, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule, Laurent Vandroux,
TSV Metallization MOCVD
• https://doi.org/10.4071/2013DPC-wp12
IMAPSource Conference Papers
MOURIER, Thierry, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule, and Laurent Vandroux. 2013. “Low Temperature MOCVD TiN Barrier Deposition for High Aspect Ratio TSVs : A Solution for 3D Integration.” IMAPSource Proceedings 2013 (DPC): 1322–42. https://doi.org/10.4071/2013DPC-wp12.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system