Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration
Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration
Thierry MOURIER, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule, Laurent Vandroux,
MOURIER, Thierry, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule, and Laurent Vandroux. 2013. “Low Temperature MOCVD TiN Barrier Deposition for High Aspect Ratio TSVs : A Solution for 3D Integration.” IMAPSource Proceedings 2013 (DPC): 1322–42. https://doi.org/10.4071/2013DPC-wp12.
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