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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Glass Carrier Wafers for the Si Thinning Process for Stack IC Applications
Aric Shorey
,
Bor-Kai Wang
,
Joe Canale
,
Windsor Thomas
,
Glass Carriers
Wafer thinning
metrology
•
https://doi.org/10.4071/2013DPC-wa11
IMAPSource Conference Papers
Shorey, Aric, Bor-Kai Wang, Joe Canale, and Windsor Thomas. 2013. “Glass Carrier Wafers for the Si Thinning Process for Stack IC Applications.”
IMAPSource Proceedings
2013 (DPC): 989–1008.
https://doi.org/10.4071/2013DPC-wa11
.
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