Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
3D Packaging- Synthetic Quartz Substrate and Interposer for High Frequency Applications
3D Packaging- Synthetic Quartz Substrate and Interposer for High Frequency Applications
Vern Stygar, Tim Mobley, Shintarou Takahashi,
Stygar, Vern, Tim Mobley, and Shintarou Takahashi. 2013. “3D Packaging- Synthetic Quartz Substrate and Interposer for High Frequency Applications.” IMAPSource Proceedings 2013 (DPC): 729–50. https://doi.org/10.4071/2013DPC-tp16.