Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Mark Oliver, Jong-Uk Kim, Michael Gallagher, Zidong Wang, Janet Okada, Elissei Iagodkine, Kai Zoschke, Matthias Wegner, Michael Töpper,
Oliver, Mark, Jong-Uk Kim, Michael Gallagher, Zidong Wang, Janet Okada, Elissei Iagodkine, Kai Zoschke, Matthias Wegner, and Michael Töpper. 2013. “Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly.” IMAPSource Proceedings 2013 (DPC): 1009–32. https://doi.org/10.4071/2013DPC-wa12.