ISSN 2380-4505
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Mark Oliver, Jong-Uk Kim, Michael Gallagher, Zidong Wang, Janet Okada, Elissei Iagodkine, Kai Zoschke, Matthias Wegner, Michael Töpper,
Oliver, Mark, Jong-Uk Kim, Michael Gallagher, Zidong Wang, Janet Okada, Elissei Iagodkine, Kai Zoschke, Matthias Wegner, and Michael Töpper. 2013. “Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly.” IMAPSource Proceedings 2013 (DPC): 1009–32. https://doi.org/10.4071/2013DPC-wa12.