Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Production of Uniform Dimension Copper Pillars for Flip Chip CSP
Production of Uniform Dimension Copper Pillars for Flip Chip CSP
Stephen Kenny, Kai Matejat, Carsten Schauer, Sven Lamprecht,
Kenny, Stephen, Kai Matejat, Carsten Schauer, and Sven Lamprecht. 2013. “Production of Uniform Dimension Copper Pillars for Flip Chip CSP.” IMAPSource Proceedings 2013 (DPC): 778–810. https://doi.org/10.4071/2013DPC-tp22.