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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

High Reliability Fine Pitch WLCSP for High Pin Count Applications

David Lawhead, Ronnie Yazzie, Tony Curtis, Guy Burgess, Ted Tessier,
WLCSP Reliability Solder
• https://doi.org/10.4071/2013DPC-tha21
IMAPSource Conference Papers
Lawhead, David, Ronnie Yazzie, Tony Curtis, Guy Burgess, and Ted Tessier. 2013. “High Reliability Fine Pitch WLCSP for High Pin Count Applications.” IMAPSource Proceedings 2013 (DPC): 1894–1907. https://doi.org/10.4071/2013DPC-tha21.
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