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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
High Reliability Fine Pitch WLCSP for High Pin Count Applications
David Lawhead
,
Ronnie Yazzie
,
Tony Curtis
,
Guy Burgess
,
Ted Tessier
,
WLCSP
Reliability
Solder
•
https://doi.org/10.4071/2013DPC-tha21
IMAPSource Conference Papers
Lawhead, David, Ronnie Yazzie, Tony Curtis, Guy Burgess, and Ted Tessier. 2013. “High Reliability Fine Pitch WLCSP for High Pin Count Applications.”
IMAPSource Proceedings
2013 (DPC): 1894–1907.
https://doi.org/10.4071/2013DPC-tha21
.
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