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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 mm to 300 mm
Andre Cardoso
,
Rui Almeida
,
Felandorio Fernandes
,
Ted Tessier
,
Anthony Curtis
,
WLCSP
Fan in
Spheron
•
https://doi.org/10.4071/2013DPC-ta24
IMAPSource Conference Papers
Cardoso, Andre, Rui Almeida, Felandorio Fernandes, Ted Tessier, and Anthony Curtis. 2013. “Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 Mm to 300 Mm.”
IMAPSource Proceedings
2013 (DPC): 471–94.
https://doi.org/10.4071/2013DPC-ta24
.
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