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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation

Ron Zhang, John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, Laura Mirkarimi,
DRAMSimulationValidation
https://doi.org/10.4071/2013DPC-wp33
IMAPSource Conference Papers
Zhang, Ron, John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, and Laura Mirkarimi. 2013. “Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation.” IMAPSource Proceedings 2013 (DPC): 1646–80. https:/​/​doi.org/​10.4071/​2013DPC-wp33.
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