Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation

Ron Zhang; John Tseng; Hala Shaba; Ellis Chau; Wael Zohni; Laura Mirkarimi

doi:10.4071/2013DPC-wp33

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Zhang, Ron, John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, and Laura Mirkarimi. 2013. “Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation.” IMAPSource Proceedings 2013 (DPC): 1646–80. https://doi.org/10.4071/2013DPC-wp33.

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