Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
Ron Zhang, John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, Laura Mirkarimi,
Zhang, Ron, John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, and Laura Mirkarimi. 2013. “Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation.” IMAPSource Proceedings 2013 (DPC): 1646–80. https://doi.org/10.4071/2013DPC-wp33.