Thibault, Raymond, Michael Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer, Xiang Qian Liu, Kim Ho, et al. 2013. “Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications.”
IMAPSource Proceedings 2013 (DPC): 1559–84.
https://doi.org/10.4071/2013DPC-wp25.