Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications
Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications
Raymond Thibault, Michael Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer, Xiang Qian Liu, Kim Ho, Greg Prokopowicz, Joe Lachowski, Mark Oliver, Eric Huenger, Seiji Inaoka, Scott Kisting, Lynne Mills, Sue McNamara, Rosemary Bell,
Thibault, Raymond, Michael Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer, Xiang Qian Liu, Kim Ho, et al. 2013. “Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications.” IMAPSource Proceedings 2013 (DPC): 1559–84. https://doi.org/10.4071/2013DPC-wp25.
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