Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:32436/feed
Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications

Raymond Thibault, Michael Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer, Xiang Qian Liu, Kim Ho, Greg Prokopowicz, Joe Lachowski, Mark Oliver, Eric Huenger, Seiji Inaoka, Scott Kisting, Lynne Mills, Sue McNamara, Rosemary Bell,
PhotodielectricResidual StressElongation
https://doi.org/10.4071/2013DPC-wp25
IMAPSource Conference Papers
Thibault, Raymond, Michael Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer, Xiang Qian Liu, Kim Ho, et al. 2013. “Low Residual Stress and High Performance Dielectric for WLP (Wafer Level Packaging) Applications.” IMAPSource Proceedings 2013 (DPC): 1559–84. https:/​/​doi.org/​10.4071/​2013DPC-wp25.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system