Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
A Versatile Optical Head for 3D IC TSV Integration Process Control
A Versatile Optical Head for 3D IC TSV Integration Process Control
G. Fresquet,
Fresquet, G. 2013. “A Versatile Optical Head for 3D IC TSV Integration Process Control.” IMAPSource Proceedings 2013 (DPC): 2015–49. https://doi.org/10.4071/2013DPC-tha32.