Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications
Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications
Julia Woertink, Erik Reddington, Inho Lee, Yi Qin, Jonathan Prange, Pedro Lopez Montesinos, Jui-Ching Lin, Masaaki Imanari, Jianwei Dong, Wataru Tachikawa, Jeff Calvert,
Woertink, Julia, Erik Reddington, Inho Lee, Yi Qin, Jonathan Prange, Pedro Lopez Montesinos, Jui-Ching Lin, et al. 2013. “Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications.” IMAPSource Proceedings 2013 (DPC): 1417–37. https://doi.org/10.4071/2013DPC-wp16.
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