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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC eliminating the need of TSV or Wire Bonding

Jemmy Sutanto, D. H. Kang, J. H. Yoon, K. S. Oh, Michael Oh, R. Lanzone, R. Huemoeller,
MEMS packaging3D StacksTSV
https://doi.org/10.4071/2013DPC-tp33
IMAPSource Conference Papers
Sutanto, Jemmy, D. H. Kang, J. H. Yoon, K. S. Oh, Michael Oh, R. Lanzone, and R. Huemoeller. 2013. “CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC Eliminating the Need of TSV or Wire Bonding.” IMAPSource Proceedings 2013 (DPC): 916–36. https:/​/​doi.org/​10.4071/​2013DPC-tp33.
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