Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC eliminating the need of TSV or Wire Bonding
CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC eliminating the need of TSV or Wire Bonding
Sutanto, Jemmy, D. H. Kang, J. H. Yoon, K. S. Oh, Michael Oh, R. Lanzone, and R. Huemoeller. 2013. “CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC Eliminating the Need of TSV or Wire Bonding.” IMAPSource Proceedings 2013 (DPC): 916–36. https://doi.org/10.4071/2013DPC-tp33.
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