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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D ICs
Kamal Karimanal
,
FEA
Assembly Process Modeling
Thermo-Mechanical
•
https://doi.org/10.4071/2013DPC-wp34
IMAPSource Conference Papers
Karimanal, Kamal. 2013. “Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D ICs.”
IMAPSource Proceedings
2013 (DPC): 1681–1716.
https://doi.org/10.4071/2013DPC-wp34
.
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