Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D ICs
Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D ICs
Karimanal, Kamal. 2013. “Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D ICs.” IMAPSource Proceedings 2013 (DPC): 1681–1716. https://doi.org/10.4071/2013DPC-wp34.
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