Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Development of Plating Process for Micro Bump Formation
Development of Plating Process for Micro Bump Formation
Takuma Katase, Koji Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, Akihiro Masuda,
Katase, Takuma, Koji Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, and Akihiro Masuda. 2013. “Development of Plating Process for Micro Bump Formation.” IMAPSource Proceedings 2013 (DPC): 751–77. https://doi.org/10.4071/2013DPC-tp21.