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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Development of Plating Process for Micro Bump Formation

Takuma Katase, Koji Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, Akihiro Masuda,
Lead Free Plating ChemicalMicro BumpCu Pillar
https://doi.org/10.4071/2013DPC-tp21
IMAPSource Conference Papers
Katase, Takuma, Koji Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, and Akihiro Masuda. 2013. “Development of Plating Process for Micro Bump Formation.” IMAPSource Proceedings 2013 (DPC): 751–77. https:/​/​doi.org/​10.4071/​2013DPC-tp21.
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