Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Development of Plating Process for Micro Bump Formation
Takuma Katase
,
Koji Tatsumi
,
Tekeshi Hatta
,
Masayuki Ishikawa
,
Akihiro Masuda
,
Lead Free Plating Chemical
Micro Bump
Cu Pillar
•
https://doi.org/10.4071/2013DPC-tp21
IMAPSource Conference Papers
Katase, Takuma, Koji Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, and Akihiro Masuda. 2013. “Development of Plating Process for Micro Bump Formation.”
IMAPSource Proceedings
2013 (DPC): 751–77.
https://doi.org/10.4071/2013DPC-tp21
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats