Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Ultra High Density Capacitors merged with Through Silicon Vias to enhance performances.
Ultra High Density Capacitors merged with Through Silicon Vias to enhance performances.
Catherine Bunel,
Bunel, Catherine. 2013. “Ultra High Density Capacitors Merged with Through Silicon Vias to Enhance Performances.” IMAPSource Proceedings 2013 (DPC): 691–728. https://doi.org/10.4071/2013DPC-tp15.