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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Ultra High Density Capacitors merged with Through Silicon Vias to enhance performances.

Catherine Bunel,
CAPACITORSThrough Silicon ViasPassives
https://doi.org/10.4071/2013DPC-tp15
IMAPSource Conference Papers
Bunel, Catherine. 2013. “Ultra High Density Capacitors Merged with Through Silicon Vias to Enhance Performances.” IMAPSource Proceedings 2013 (DPC): 691–728. https:/​/​doi.org/​10.4071/​2013DPC-tp15.
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