Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
The Reliability Study of a High density Multi Chip Packaging with Folding Flexible Substrate
The Reliability Study of a High density Multi Chip Packaging with Folding Flexible Substrate
Yin Wen, Bo Zhang, Yuan Lu, Liao Anmou, Du Tianmin, Lixi Wan,
Wen, Yin, Bo Zhang, Yuan Lu, Liao Anmou, Du Tianmin, and Lixi Wan. 2013. “The Reliability Study of a High Density Multi Chip Packaging with Folding Flexible Substrate.” IMAPSource Proceedings 2013 (DPC): 1846–1969. https://doi.org/10.4071/2013DPC-tha13.