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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
From Mechanical to Chemical Adhesion
Meng Hsieh
,
Ellina Libman
,
Lutz Brandt
,
adhesion
roughness
substrates
•
https://doi.org/10.4071/2013DPC-wa22
IMAPSource Conference Papers
Hsieh, Meng, Ellina Libman, and Lutz Brandt. 2013. “From Mechanical to Chemical Adhesion.”
IMAPSource Proceedings
2013 (DPC): 1106–33.
https://doi.org/10.4071/2013DPC-wa22
.
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