Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Ehrenfried Zschech, Kong Boon Yeap, Christoph Sander, Uwe Mühle, Valeriy Sukharev,
Zschech, Ehrenfried, Kong Boon Yeap, Christoph Sander, Uwe Mühle, and Valeriy Sukharev. 2013. “Multi-Scale Materials Data for 3D TSV Stack Performance Simulation and Model Validation.” IMAPSource Proceedings 2013 (DPC): 1–38. https://doi.org/10.4071/2013DPC-tha31.