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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Integration, Electrical Performance and Reliability Investigation of TSV

Shih-Wei Lee, Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, Kuan-Neng Chen,
TSV sealing bump method reliability test
• https://doi.org/10.4071/2013DPC-tha12
IMAPSource Conference Papers
Lee, Shih-Wei, Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen. 2013. “Integration, Electrical Performance and Reliability Investigation of TSV.” IMAPSource Proceedings 2013 (DPC): 1817–45. https://doi.org/10.4071/2013DPC-tha12.
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