Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
ChipsetT: Embedded Die Substrate Applications
ChipsetT: Embedded Die Substrate Applications
Jon G. Aday, Ted Tessier, Kazuhisa Itoi, Satoshi Okude,
Aday, Jon G., Ted Tessier, Kazuhisa Itoi, and Satoshi Okude. 2013. “ChipsetT: Embedded Die Substrate Applications.” IMAPSource Proceedings 2013 (DPC): 377–97. https://doi.org/10.4071/2013DPC-ta13.