Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology
Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology
Curtis Zwenger, JinYoung Khim, YoonJoo Khim, SeWoong Cha, SeungJae Lee, JinHan Kim,
Zwenger, Curtis, JinYoung Khim, YoonJoo Khim, SeWoong Cha, SeungJae Lee, and JinHan Kim. 2013. “Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology.” IMAPSource Proceedings 2013 (DPC): 1486–1519. https://doi.org/10.4071/2013DPC-wp23.