Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology

Curtis Zwenger; JinYoung Khim; YoonJoo Khim; SeWoong Cha; SeungJae Lee; JinHan Kim

doi:10.4071/2013DPC-wp23

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Zwenger, Curtis, JinYoung Khim, YoonJoo Khim, SeWoong Cha, SeungJae Lee, and JinHan Kim. 2013. “Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology.” IMAPSource Proceedings 2013 (DPC): 1486–1519. https://doi.org/10.4071/2013DPC-wp23.

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