Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics
3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics
Rabindra Das, Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz,
Das, Rabindra, Frank D. Egitto, Steven G. Rosser, Erich Kopp, and Barry Bonitz. 2013. “3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics.” IMAPSource Proceedings 2013 (DPC): 618–34. https://doi.org/10.4071/2013DPC-tp12.