Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications
A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications
Z. Cole, B. S. Passmore, B. Whitaker, A. Barkley, T. McNutt, A. B. Lostetter,
Cole, Z., B. S. Passmore, B. Whitaker, A. Barkley, T. McNutt, and A. B. Lostetter. 2013. “A High Temperature, Fast Switching SiC Multi-Chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications.” IMAPSource Proceedings 2013 (HITEN): 56–60. https://doi.org/10.4071/HITEN-MP11.