Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
DIP Test Socket Characterization for 300°C
DIP Test Socket Characterization for 300°C
David Shaddock, Liang Yin, Zhenzhen Shen, Zhangming Zhou, R. Wayne Johnson,
Shaddock, David, Liang Yin, Zhenzhen Shen, Zhangming Zhou, and R. Wayne Johnson. 2013. “DIP Test Socket Characterization for 300°C.” IMAPSource Proceedings 2013 (HITEN): 213–19. https://doi.org/10.4071/HITEN-WA12.