Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
M. Mirgkizoudi, C. Liu, P. Conway, S. Riches,
Mirgkizoudi, M., C. Liu, P. Conway, and S. Riches. 2013. “Reliability of Wire-Bonded Electronic Devices in Combined High Temperature and Vibrational Environments.” IMAPSource Proceedings 2013 (HITEN): 220–28. https://doi.org/10.4071/HITEN-WA13.