Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments

M. Mirgkizoudi; C. Liu; P. Conway; S. Riches

doi:10.4071/HITEN-WA13

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Mirgkizoudi, M., C. Liu, P. Conway, and S. Riches. 2013. “Reliability of Wire-Bonded Electronic Devices in Combined High Temperature and Vibrational Environments.” IMAPSource Proceedings 2013 (HITEN): 220–28. https://doi.org/10.4071/HITEN-WA13.

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