Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Lead-free Solder Attach for 200°C Applications
Lead-free Solder Attach for 200°C Applications
Zhenzhen Shen, Kun Fang, Mike Hamilton, R. Wayne Johnson, Erica Snipes, Michael Bozack,
Shen, Zhenzhen, Kun Fang, Mike Hamilton, R. Wayne Johnson, Erica Snipes, and Michael Bozack. 2013. “Lead-Free Solder Attach for 200°C Applications.” IMAPSource Proceedings 2013 (HITEN): 260–67. https://doi.org/10.4071/HITEN-WA18.