Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
LT-TLPS Die Attach for High Temperature Electronic Packaging
LT-TLPS Die Attach for High Temperature Electronic Packaging
Hannes Greve, F. Patrick McCluskey,
Greve, Hannes, and F. Patrick McCluskey. 2013. “LT-TLPS Die Attach for High Temperature Electronic Packaging.” IMAPSource Proceedings 2013 (HITEN): 246–53. https://doi.org/10.4071/HITEN-WA16.