Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
Eric Jian Rong Phua, Ming Liu, Riko I Made, Liying Zhang, Chee Cheong Wong, Zhong Chen, Min Woo Rhee, Xiao Hu, Chee Lip Gan,
Phua, Eric Jian Rong, Ming Liu, Riko I Made, Liying Zhang, Chee Cheong Wong, Zhong Chen, Min Woo Rhee, Xiao Hu, and Chee Lip Gan. 2013. “Novel Encapsulation Materials for High Pressure-High Temperature (HPHT) Applications.” IMAPSource Proceedings 2013 (HITEN): 268–74. https://doi.org/10.4071/HITEN-WA19.