Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
Riko I Made, Eric Jian Rong Phua, Key Wen Tan, Wei Chuan Ong, Clare Guanqi Huang, Hock Guan Ong, Vivek Chidambaram Nachiappan, Chee Cheong Wong, Chen Zhong, Chee Lip Gan,
Made, Riko I, Eric Jian Rong Phua, Key Wen Tan, Wei Chuan Ong, Clare Guanqi Huang, Hock Guan Ong, Vivek Chidambaram Nachiappan, Chee Cheong Wong, Chen Zhong, and Chee Lip Gan. 2013. “Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment.” IMAPSource Proceedings 2013 (HITEN): 207–12. https://doi.org/10.4071/HITEN-WA11.
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