Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
Kato, Fumiki, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2013. “Precise Chip Joint Method with Sub-Micron Au Particle for High-Density SiC Power Module Operating at High Temperature.” IMAPSource Proceedings 2013 (HITEN): 254–59. https://doi.org/10.4071/HITEN-WA17.
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