Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
Fumiki Kato, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato,
Kato, Fumiki, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2013. “Precise Chip Joint Method with Sub-Micron Au Particle for High-Density SiC Power Module Operating at High Temperature.” IMAPSource Proceedings 2013 (HITEN): 254–59. https://doi.org/10.4071/HITEN-WA17.