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High Temperature Conference Papers
Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT

Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature

Fumiki Kato, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato,
Precise chip jointSub-micron Au particleHigh-density SiC power moduleHigh-temperature operation
https://doi.org/10.4071/HITEN-WA17
IMAPSource Conference Papers
Kato, Fumiki, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2013. “Precise Chip Joint Method with Sub-Micron Au Particle for High-Density SiC Power Module Operating at High Temperature.” IMAPSource Proceedings 2013 (HITEN): 254–59. https:/​/​doi.org/​10.4071/​HITEN-WA17.
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