Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Packaging technologies for high temperature control electronics
Packaging technologies for high temperature control electronics
Conor Slater, Radisav Cojbasic, Thomas Maeder, Yusuf Leblebici, Peter Ryser,
Slater, Conor, Radisav Cojbasic, Thomas Maeder, Yusuf Leblebici, and Peter Ryser. 2013. “Packaging Technologies for High Temperature Control Electronics.” IMAPSource Proceedings 2013 (HITEN): 184–92. https://doi.org/10.4071/HITEN-TP15.