Novel solder-mesh interconnection design for power module applications

Adrian Lis; Hiroaki Tatsumi; Tomoki Matsuda; Tomokazu Sano; Yoshihiro Kashiba; Akio Hirose

doi:10.4071/2380-4491-2018-HiTEN-000057

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Lis, Adrian, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, and Akio Hirose. 2018. “Novel Solder-Mesh Interconnection Design for Power Module Applications.” IMAPSource Proceedings 2018 (HiTEC): 57–62. https://doi.org/10.4071/2380-4491-2018-HiTEN-000057.

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