Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
Novel solder-mesh interconnection design for power module applications
Novel solder-mesh interconnection design for power module applications
Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose,
Lis, Adrian, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, and Akio Hirose. 2018. “Novel Solder-Mesh Interconnection Design for Power Module Applications.” IMAPSource Proceedings 2018 (HiTEC): 57–62. https://doi.org/10.4071/2380-4491-2018-HiTEN-000057.