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High Temperature Conference Papers
Vol. 2018, Issue HiTEC, 2018
May 01, 2018 EDT
Novel solder-mesh interconnection design for power module applications
Adrian Lis
,
Hiroaki Tatsumi
,
Tomoki Matsuda
,
Tomokazu Sano
,
Yoshihiro Kashiba
,
Akio Hirose
,
Solder-mesh composite joints
shear strength
microstructure
reliability
thermal finite element modeling
•
https://doi.org/10.4071/2380-4491-2018-HiTEN-000057
IMAPSource Conference Papers
Lis, Adrian, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, and Akio Hirose. 2018. “Novel Solder-Mesh Interconnection Design for Power Module Applications.”
IMAPSource Proceedings
2018 (HiTEC): 57–62.
https://doi.org/10.4071/2380-4491-2018-HiTEN-000057
.
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