Wakasugi, Naoki, Shijo Nagao, Kim Dongjin, and Katsuaki Suganuma. 2018. “High Heat-Density SiC Heater Chip for Thermal Characterization of High Temperature Packaging.” IMAPSource Proceedings 2018 (HiTEC): 93–97. https://doi.org/10.4071/2380-4491-2018-HiTEN-000093.