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High Temperature Conference Papers
Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT

High heat-density SiC heater chip for thermal characterization of high temperature packaging

Naoki Wakasugi, Shijo Nagao, Kim Dongjin, Katsuaki Suganuma,
ceramic substratereliabilitySiCthermal resistance
https://doi.org/10.4071/2380-4491-2018-HiTEN-000093
IMAPSource Conference Papers
Wakasugi, Naoki, Shijo Nagao, Kim Dongjin, and Katsuaki Suganuma. 2018. “High Heat-Density SiC Heater Chip for Thermal Characterization of High Temperature Packaging.” IMAPSource Proceedings 2018 (HiTEC): 93–97. https:/​/​doi.org/​10.4071/​2380-4491-2018-HiTEN-000093.
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