High heat-density SiC heater chip for thermal characterization of high temperature packaging

Naoki Wakasugi; Shijo Nagao; Kim Dongjin; Katsuaki Suganuma

doi:10.4071/2380-4491-2018-HiTEN-000093

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Wakasugi, Naoki, Shijo Nagao, Kim Dongjin, and Katsuaki Suganuma. 2018. “High Heat-Density SiC Heater Chip for Thermal Characterization of High Temperature Packaging.” IMAPSource Proceedings 2018 (HiTEC): 93–97. https://doi.org/10.4071/2380-4491-2018-HiTEN-000093.

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