Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
High heat-density SiC heater chip for thermal characterization of high temperature packaging
High heat-density SiC heater chip for thermal characterization of high temperature packaging
Naoki Wakasugi, Shijo Nagao, Kim Dongjin, Katsuaki Suganuma,
Wakasugi, Naoki, Shijo Nagao, Kim Dongjin, and Katsuaki Suganuma. 2018. “High Heat-Density SiC Heater Chip for Thermal Characterization of High Temperature Packaging.” IMAPSource Proceedings 2018 (HiTEC): 93–97. https://doi.org/10.4071/2380-4491-2018-HiTEN-000093.