Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages
Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages
Beebout, Charlie, and Erick M. Spory. 2018. “Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages.” IMAPSource Proceedings 2018 (HiTEC): 39–44. https://doi.org/10.4071/2380-4491-2018-HiTEN-000039.
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