Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
From Chips to Modules: Tackling the High Temperature Design Challenge
From Chips to Modules: Tackling the High Temperature Design Challenge
Pierre Delatte, Zlatan Gradincic,
Delatte, Pierre, and Zlatan Gradincic. 2018. “From Chips to Modules: Tackling the High Temperature Design Challenge.” IMAPSource Proceedings 2018 (HiTEC): 116–19. https://doi.org/10.4071/2380-4491-2018-HiTEN-000116.