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High Temperature Conference Papers
Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT

Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

Fumiki Kato, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato,
250°C operating SiC power moduleZn-Al eutectic soldertransient thermal analysis
https://doi.org/10.4071/2380-4491-2018-HiTEN-000028
IMAPSource Conference Papers
Kato, Fumiki, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2018. “Identification of Thermo-Mechanical Fatigue Fracture Location by Transient Thermal Analysis for High-Temperature Operating SiC Power Module Assembled with ZnAl Eutectic Solder.” IMAPSource Proceedings 2018 (HiTEC): 28–31. https:/​/​doi.org/​10.4071/​2380-4491-2018-HiTEN-000028.
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