Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
Fumiki Kato, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato,
Kato, Fumiki, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2018. “Identification of Thermo-Mechanical Fatigue Fracture Location by Transient Thermal Analysis for High-Temperature Operating SiC Power Module Assembled with ZnAl Eutectic Solder.” IMAPSource Proceedings 2018 (HiTEC): 28–31. https://doi.org/10.4071/2380-4491-2018-HiTEN-000028.
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