Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
Subramani Manoharan, Chandradip Patel, Stevan Hunter, Patrick McCluskey,
Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. 2018. “Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition.” IMAPSource Proceedings 2018 (HiTEC): 32–38. https://doi.org/10.4071/2380-4491-2018-HiTEN-000032.