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High Temperature Conference Papers
Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT

Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition

Subramani Manoharan, Chandradip Patel, Stevan Hunter, Patrick McCluskey,
Copper Wire BondShear StrengthReliabilityIntermetallic Compound (IMC)
https://doi.org/10.4071/2380-4491-2018-HiTEN-000032
IMAPSource Conference Papers
Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. 2018. “Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition.” IMAPSource Proceedings 2018 (HiTEC): 32–38. https:/​/​doi.org/​10.4071/​2380-4491-2018-HiTEN-000032.
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