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ISSN 2380-4505
Ceramics Conference Papers
Vol. 2012, Issue CICMT, 2012September 01, 2012 EDT

An evaluation of thick-film silver die-attachment as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Bo Jiang, Paul Muralt, Thomas Maeder,
μ-SOFCthick-film metallizationdie-attachment
https://doi.org/10.4071/CICMT-2012-WA11
IMAPSource Conference Papers
Jiang, Bo, Paul Muralt, and Thomas Maeder. 2012. “An Evaluation of Thick-Film Silver Die-Attachment as Micro Solid Oxide Fuel Cells (μ-SOFCs) Interconnection Packaging.” IMAPSource Proceedings 2012 (CICMT): 269–76. https:/​/​doi.org/​10.4071/​CICMT-2012-WA11.

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