Bonding of 2 mm thick silicon wafers using LTCC as an intermediate layer

S. Günschmann; M. Fischer; T. Bley; I. Käpplinger; W. Brode; H. Mannebach; J. Müller

doi:10.4071/CICMT-2012-WA416

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Günschmann, S., M. Fischer, T. Bley, I. Käpplinger, W. Brode, H. Mannebach, and J. Müller. 2012. “Bonding of 2 Mm Thick Silicon Wafers Using LTCC as an Intermediate Layer.” IMAPSource Proceedings 2012 (CICMT): 436–40. https://doi.org/10.4071/CICMT-2012-WA416.

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