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Ceramics Conference Papers
Vol. 2012, Issue CICMT, 2012September 01, 2012 EDT

Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments

Brian Patterson, Srikanth Kulkarni, Aicha Elshabini, Fred Barlow,
Direct Bonded Copper (DBC)Direct Bonded Aluminum (DBA)Active Metal Bond / Braze (AMB) substratessurface roughnesshigh temperature thermal shock
https://doi.org/10.4071/CICMT-2012-TA12
IMAPSource Conference Papers
Patterson, Brian, Srikanth Kulkarni, Aicha Elshabini, and Fred Barlow. 2012. “Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments.” IMAPSource Proceedings 2012 (CICMT): 12–17. https:/​/​doi.org/​10.4071/​CICMT-2012-TA12.
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