Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments

Brian Patterson; Srikanth Kulkarni; Aicha Elshabini; Fred Barlow

doi:10.4071/CICMT-2012-TA12

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Patterson, Brian, Srikanth Kulkarni, Aicha Elshabini, and Fred Barlow. 2012. “Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments.” IMAPSource Proceedings 2012 (CICMT): 12–17. https://doi.org/10.4071/CICMT-2012-TA12.

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