Vol. 2012, Issue CICMT, 2012September 01, 2012 EDT
Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments
Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments
Brian Patterson, Srikanth Kulkarni, Aicha Elshabini, Fred Barlow,
Patterson, Brian, Srikanth Kulkarni, Aicha Elshabini, and Fred Barlow. 2012. “Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments.” IMAPSource Proceedings 2012 (CICMT): 12–17. https://doi.org/10.4071/CICMT-2012-TA12.