Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications
End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications
Riches, S T, C Johnston, A Crossley, and P Grant. 2012. “End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications.” IMAPSource Proceedings 2012 (HITEC): 327–34. https://doi.org/10.4071/HITEC-2012-THA21.
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