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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012
January 01, 2012 EDT
End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications
S T Riches
,
C Johnston
,
A Crossley
,
P Grant
,
Silicon-on-Insulator devices
signal conditioning circuits
high temperature electronics packaging
•
https://doi.org/10.4071/HITEC-2012-THA21
IMAPSource Conference Papers
Riches, S T, C Johnston, A Crossley, and P Grant. 2012. “End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications.”
IMAPSource Proceedings
2012 (HITEC): 327–34.
https://doi.org/10.4071/HITEC-2012-THA21
.
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