Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic Modules
Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic Modules
R. Shaw, P. Doyle, J. Hornberger, A. Lostetter, B. McPherson, H. Procell, R. Schupbach,
Shaw, R., P. Doyle, J. Hornberger, A. Lostetter, B. McPherson, H. Procell, and R. Schupbach. 2012. “Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic Modules.” IMAPSource Proceedings 2012 (HITEC): 345–53. https://doi.org/10.4071/HITEC-2012-THA23.