Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPa
Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPa
Kewei Xiao, Jesus N. Calata, Hanguang Zheng, Khai D.T. Ngo, Guo-Quan Lu,
Xiao, Kewei, Jesus N. Calata, Hanguang Zheng, Khai D.T. Ngo, and Guo-Quan Lu. 2012. “Large-Area Nanosilver Die-Attach by Hot-Pressing Below 200°C and 5 MPa.” IMAPSource Proceedings 2012 (HITEC): 129–34. https://doi.org/10.4071/HITEC-2012-TP25.