Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPa

Kewei Xiao; Jesus N. Calata; Hanguang Zheng; Khai D.T. Ngo; Guo-Quan Lu

doi:10.4071/HITEC-2012-TP25

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Xiao, Kewei, Jesus N. Calata, Hanguang Zheng, Khai D.T. Ngo, and Guo-Quan Lu. 2012. “Large-Area Nanosilver Die-Attach by Hot-Pressing Below 200°C and 5 MPa.” IMAPSource Proceedings 2012 (HITEC): 129–34. https://doi.org/10.4071/HITEC-2012-TP25.

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