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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT

Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPa

Kewei Xiao, Jesus N. Calata, Hanguang Zheng, Khai D.T. Ngo, Guo-Quan Lu,
high-temperature packaginglarge-area die-attachlow-temperature hot-pressingnanosilver sintered joint
https://doi.org/10.4071/HITEC-2012-TP25
IMAPSource Conference Papers
Xiao, Kewei, Jesus N. Calata, Hanguang Zheng, Khai D.T. Ngo, and Guo-Quan Lu. 2012. “Large-Area Nanosilver Die-Attach by Hot-Pressing Below 200°C and 5 MPa.” IMAPSource Proceedings 2012 (HITEC): 129–34. https:/​/​doi.org/​10.4071/​HITEC-2012-TP25.
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